In addition to being leading supplier of glide and burnish heads to computer and mass data storage industry, we offer our customers engineering and testing services and customized manufacturing. With over 32,000 square feet of state-of-the-art facility in Silicon Valley and our collection of experienced engineers, manufacturing personnel and leading-edge equipment, we meet a full range of fill and finish needs from development through commercialization. Please contact us to find out more about our services and how we can assist you in your specific application.

Precision Manufacturing

  • Wafer dicing
  • Wafer grinding
  • Lapping and Polishing (ceramic capability)
  • Ultrasonic cleaning line
  • Glass Frit
  • Micro-soldering
  • Pick & place automated bonding

Semiconductor Processing

  • Plasma etch (RIE)
  • Wet Etch
  • Sputtering (SiO2, SiO, Cu, Magnetic alloys)
  • Photolithography (Wet and dry Photoresist)

Test and Measurement

  • SEM with EDX capability
  • AFM
  • Surface profilometry
  • Laser Interferometry
  • Spectroscopic Ellipsometry
  • ICP-MS
Lab Technician
Sputting Room
Testing Room
Dicing Saws